We developed a new technology of ultra-hard materials cutting using pulsed laser. The technology allows the cutting of conductive and non-metallic materials at higher speeds to optimise the use of cutting capacity.
The solution developed by our team of developers and subsequent cooperation with our other partners from Switzerland, Germany and the Czech Republic morphed into the device Biatec Laser BLT F3  /version Fiber 3/.
This device is already gaining acclaim internationally especially for the cutting speed, the overall user experience and substantially lower energy and space requirements compared to previous technologies.

For more informations: www.biateclaser.com